Defense Microelectronic Activity

Advanced Technology Support Program

ATSP IV – 5th Generation Engineering Services Contract Vehicle

$17.471 billion ceiling 10 year contract (end date 3/31/2026)

The Advanced Technology Support Program is an Indefinite Delivery/Indefinite Quantity (IDIQ) contracting vehicle providing streamlined contracting access for all federal organizations of the U.S. Government to develop advanced microelectronics based technology solutions. The objective is to quickly access advanced solutions from competitively selected contractors, having proven advanced technology capability.

  • BAE Systems
  • Boeing
  • General Dynamics
  • Honeywell
  • Lockheed Martin
  • Northrup Grumman
  • Cobham (CAES)
  • Raytheon

DMEA is a complete contract provider that focuses on streamlined acquisition and management processes while providing collaborative contractor and Government relationship that can quickly meet the needs of the warfighter. We feature acquisition trained Engineers as single point of contact Program Mangers that are mission and customer oriented to provide significant technical capability with shorter target times to award. Typical technologies include discrete electronics, integrated circuits, circuit boards, modules, assemblies, subsystems, and systems.

The ATSP IV scope includes all "direct" engineering activities (e.g., studies, analysis, design, code, simulation, fabrication, packaging/assembly, prototyping, integration, installation, testing, and limited production) involved in the development of electronic systems. It also includes all the "in-direct" technical, functional, and management activities necessary to successfully accomplish the "direct" engineering activities. The ATSP4 contract "in-direct" activities include systems engineering, program management, configuration management, quality assurance, system test and evaluation, certification, logistics support, training, warranties, development and management of data, operational site activation, and development of peculiar support equipment for which "direct" activities are being conducted.

Items include:

  • Advanced technology development
  • Hardware/software/system performance or functionality upgrades
  • Reliability/maintainability enhancements
  • Board- or box-level form-fit-function replacements
  • Life Cycle Cost reductions
  • Studies, analysis, and capabilities development